Package Materials Encapsulating Resin Materials Electrodes Materials Weight Heat-Resistant Polymer (） Silicone Resin(with phosphor) + Ag-plated Copper Alloy 0.010g(TYP) * 。 Dimensions do not include mold flash or metal burr. A Protection D.

NSSL100CT

NSSL100DT

NSSL157AT-H3

NSSLT02AT

NSSLT02AT-V1

NSS1001CL

NSS12100M3T5G

NSS12100UW3TCG

NSS12100XV6T1G

NSS12200LT1G

NSS12200WT1G

NSS12500UW3T2G

NSS12600CF8T1G

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